
The improved EUV patterns increase yields and improve chip power and performance.

The Sym3 chambers gently remove EUV resist materials and then redeposit material in a special way that averages out the pattern variability caused by stochastic errors. Compared to spin-on deposition, Applieds CVD film helps customers tune the EUV hardmask layers for specific thicknesses and etch resiliency so they can achieve near-perfect EUV pattern transfer uniformity across the entire wafer.Īpplied also detailed a special capability of its Sym3 Y etch systems which enables customers to etch and deposit materials in the same chambers to help improve EUV patterns before they are etched into the wafer. Today, Applied is introducing the Stensar Advanced Patterning Film for EUV which is deposited using Applieds Precision CVD (chemical vapor deposition) system. Until now, these layers have been deposited using spin-on technology.
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However, the industry has reached a point where further scaling with EUV is introducing challenges that require new approaches to deposition, etch and metrology.įollowing EUV resist development, chip patterns need to be etched through a series of intermediate layers called the transfer layer and hardmask before they are finally etched into the wafer. The emergence of extreme ultraviolet (EUV) lithography has enabled chipmakers to produce smaller features and increase transistor density. We are also detailing how GAA transistors will be manufactured in fundamentally different ways than todays FinFET transistors, and how Applied is ready with the broadest product line for GAA manufacturing including new steps in epitaxy, atomic layer deposition and selective materials removal along with two new Integrated Materials Solutions TM for creating ideal GAA gate oxides and metal gates.

Prabu Raja, Senior Vice President and General Manager of the Semiconductor Products Group at Applied Materials. Together, these techniques can help chipmakers as they aim to deliver future generations of logic chips with improved power, performance, area, cost and time-to-market or PPACt.Īpplieds strategy is to be the PPACt enablement company for our customers, and today we are presenting seven innovations designed to enable customers to continue 2D scaling with EUV, said Dr. These latter approaches, which include backside power distribution networks and Gate-All-Around (GAA) transistors, are expected to drive a growing proportion of logic density improvements in future years as classic 2D scaling slows. The other is using design technology cooptimization (DTCO) and 3D techniques that cleverly optimize the layout of logic cells to increase density independent of changes in the lithography pitch. One is classic Moores Law 2D scaling, creating smaller features using EUV lithography and materials engineering.

It is in the forefront of mobile encoders which are changing the way content is delivered from anywhere to any device.Chipmakers are pursuing two complementary paths to increase transistor density in the years ahead. "We are very exited to see products that make it easier and more cost-effective for users to stream their content," commented Alex Dobrushin, CMO, Wowza Media Systems. Michael Westphal, CEO miniCASTER(R): "Our Team has put some extra effort in new features and product versions which will perfectly fit in different broadcast scenarios and help producers/broadcasters to save money and stream live in extraordinary quality within seconds." miniCASTER(R) works very efficiently and is highly recommended for use with Wowza Media Server(R), the unified any-screen delivery platform from Wowza Media Systems(R). Streaming settings can easily be changed via remote access and are also editable directly on the device itself. While encoding and delivering several streams, miniCASTER(R) is able to record at the same time. The ultra-mobile miniCASTER(R) is the perfect companion for state of the art mobile broadcasting scenarios like newsgathering, emergency response, behind-the-scenes reports from major Sports events, conferences, exhibitions or simply any event you can imagine. The first units can be ordered right at the stand SU9502G3 in the "Destination Broadband Pavillion" or on the website. The revolutionary miniCASTER(R) will be shown at NABShow 2011 in Las Vegas, Nevada taking place from April 11-14.

UNTERFOEHRING, Germany, Ma/PRNewswire/ - The next milestone on the "Live Revolution Roadmap" is just around the corner and marks the date, when miniCASTER(R), the world's first hardware-based H.264 live streaming encoder in pocket-size can be ordered. MiniCASTER(R): Livestreaming as Easy as a Phone Call
